Janos Fucsko, John Mikulsky, Marjorie Balazs
Proceedings of the Semiconductor Pure Water and Chemicals Conference (SPWCC)
Shrinking device dimensions limit the level of contamination that can be tolerated on wafer surfaces. This trend sets more stringent requirements for both the purity of processing solutions as well as the fab environment. The paper presents data illustrating the state of the art analytical laboratory can keep pace with the new challenges of contamination control. Read more