Fuhe Li and Scott Anderson
Proceedings of the IEEE®/CPMT/SEMI®: International Electronics Manufacturing Technology Symposium
2004
Our recent studies with laser ablation ICP mass spectrometry (LA ICP-MS) have been focused specifically on the development of this technique for practical analysis of packaging/assembly materials involved in back-end manufacturing processes where elemental composition, element ratios, and trace metallic contamination are of critical importance. In this paper we will describe the advantages of the LA ICP-MS technique, and applications where LA ICPMS has been applied to packaging manufacturing for defect reduction in materials and overall yield enhancement. Read more