Some organometallic precursors provide challenging problems for the analysis of trace metals by ICP-MS. Trace metal analysis by conventional methods can easily yield incorrect results, allowing the trace metals to remain undiscovered until films are produced on wafer. At that point, serious questions will come from the fab engineer. If proper testing and quantification methods are not developed, the initial certificates of analyses that demonstrate material quality will be incorrect and the actual contaminants can impact yield on the processed wafers. Read more