VPD ICP-MS (Vapor Phase Decomposition followed by ICP-MS analysis) is an analytical technique gaining momentum as an important method used to measure trace metal surface contamination on wafer surfaces. Historically, TXRF has been used to analyze surface metal contamination since many facilities have TXRF equipment available in-house, providing quick results. However, VPD offers distinct advantages, making it a more thorough technique. Compared to TXRF, VPD provides results for the entire mass spectrum including lithium and boron, offers lower detection limits and has the ability to analyze the entire wafer surface. Read more