V.K.F. Chia, Ph.D.
Advanced Semiconductor Manufacturing Conference Proceedings
July 2010
Wafer tool cleanliness specifications are generally accepted for various processes and technology nodes. However, the material and component cleanliness required to meet these wafer tool cleanliness is vague. One reason is the lack of uniformly accepted parts cleanliness tests. This paper reviews and recommends test methods for determining the cleanliness of coupons, first articles and production parts. Read more