Since 1975 We have experience characterizing a variety of bulk materials, both inorganic and organic in nature, for semiconductor, photovoltaic, disk drive, nanotech, defense, and biomedical industries.
Analyses Provided
- Compositional analysis
- Depth profiling, line scan and three-dimensional mapping
- Microscopic or local analysis for contamination identification
- Surface analysis
- Trace bulk impurity analysis
Applications
- Silicon (amorphous, single crystal, polycrystalline, solar grade, and metallurgic grade)
- Sputtering targets (eAZO, CuGa, CuIn, In, CdS, and Mo)
- Glass and quartz
- Solid and flexible polymers (PP, PVC, PFE, PTFE and O-rings)
- Metal-sacked supports
- Low-k and high-k materials
- Aluminum, alumina, and anodized coating
- Various metals and alloys used for electric contact or interconnect (Al, Cu, Ag …)
- Refectory materials such as diamond, graphite, SiC, and Si3N4
- CMP pads
- Chemical powders
- NiP and hard disks
- Light emitting diodes (LEDs), capacitors, resistors, sensors, and small medical devices.
- Flat panel displays
- Bonding wires, lead frame, solder balls, masks and final testing probes
- Others
Analytical Metrology
- Glow discharge optical emission spectroscopy (GD-OES)
- Inductively coupled plasma mass spectrometry (ICP-MS)
- Inductively coupled plasma optical emission spectroscopy (ICP-OES)
- Laser ablation ICP mass spectrometry (LA ICP-MS)
- Energy dispersive spectroscopy (SEM-EDS)
- Secondary ion mass spectrometry (SIMS)
- UV/Vis spectroscopy
- X-ray fluorescence (XRF)
- Auger (AES)
- ESCA/XPS
- Interstitial gas analysis
- Minority carrier lifetime measurement (MCL)
- Rutherford backscattering spectroscopy (RBS)
- Time of flight secondary ion mass spectrometry (TOF-SIMS)
- XRD, TXRF, and X-ray imaging