Typical Films Analyzed
Semiconductor and Disk Drive
- Silicon, native and thermal silicon oxides, silicon nitride, and silicon oxynitride
- BSG, PSG, and BPSG low-k dielectrics
- Atomic layer deposition (ALD) metal oxides
- Aluminum, copper doped aluminum, copper, and other films used for interconnect
- Alumina, anodized alumina, diamond, graphite, and SiC
- SiGe, GaAs, TiW, NiCr, FeCr, III-V and II-VI films
- GST, SST and other phase change memory (PCM)
- NiP and hard disks
- Others...
Photovoltaic and Solar
- Silicon films (single, polysilicon, and ribbon)
- CdTe
- CIG, CdS, Indium (In) and CIGS
- Carbon / graphite
- AZO and other TCO front contact
- Mo, Cu, and other back contacts
- Encapsulation thin films
- Others...
Analyses Provided
- Compositional analysis
- Depth profiling, line scan and three-dimensional mapping
- Microscopic or local analysis for contamination identification
- Surface analysis
- Trace in-film impurity analysis
Analytical Techniques
- Glow discharge optical emission spectroscopy (GD-OES)
- Inductively coupled plasma mass spectrometry (ICP-MS)
- Inductively coupled plasma optical emission spectroscopy (ICP-OES)
- Laser ablation inductively coupled plasma mass spectrometry (LA ICP-MS)
- Energy dispersive spectroscopy (SEM-EDS)
- Secondary ion mass spectrometry (SIMS)
- UV/Vis spectroscopy
- X-ray fluorescence (XRF)
- Auger (AES)
- Electron spectroscopy for chemical analysis / X-ray photoelectron spectroscopy (ESCA/XPS)
- Interstitial gas analysis
- Minority carrier lifetime measurement (MCL)
- Rutherford backscattering spectroscopy (RBS)
- Time of flight secondary ion mass spectrometry (TOF-SIMS)
- X-ray diffraction (XRD), total reflection X-ray fluorescence (TXRF), and X-ray imaging